National Repository of Grey Literature 5 records found  Search took 0.01 seconds. 
Applications of Adhesives in Microelectronics Assembly
Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive to a printed circuit boards. The following section is an experimental and discusses environmental influences, as increase humidity and temperature, on properties of conductive adhesive joint.
Applications of Adhesives in Microelectronics Assembly
Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive to a printed circuit boards. The following section is an experimental and discusses environmental influences, as increase humidity and temperature, on properties of conductive adhesive joint.
Applications of Adhesives in Microelectronics Assembly
Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive to a printed circuit boards. The following section is an experimental and discusses environmental influences, as increase humidity and temperature, on properties of conductive adhesive joint.
Applications of Adhesives in Microelectronics Assembly
Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive to a printed circuit boards. The following section is an experimental and discusses environmental influences, as increase humidity and temperature, on properties of conductive adhesive joint.
Properties of conductive connections
BJALKOV, Pavel
In the introduction of the thesis there are described and explained basic terms used in designing and making printed circuits including the description of technological environment. The thesis deals with the description of jointing and the technology of assembling electronic components with boards of printed circuits. Further it also contents various types of tests of conductive joints quality and technologies of mounting parts in manufacturing process with examples of possible mistakes occurring during mounting and soldering the parts on boards of printed circuits

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